Authorized distributor for Superior Flux in Singapore and Southeast Asia.
Actual packaging may differ because it is shipped in via drums and re-packaged to suit your volume quantity*
Superior Supersafe No. 30 — GENERAL PURPOSE, VOC-FREE ORGANIC ACID FLUX
Formulated for electronic, electrical, industrial, artisan, and aerospace applications, including:
Printed Circuit Boards (PCBs)
Semiconductor and Component Lead Tinning
Used for Copper, Beryllium-Copper, Nickel, Alloy 42, Alloy 51, Brass, and some steels.
VOC-Free formulation is non-hazardous and environmentally friendly.
Conforms to IPC ANSI J-STD-004, Type ORM1
Broad activity range an excellent choice for Tin/Lead, Tin/Silver, Tin/Bismuth, and Indium solder alloys.
DESCRIPTION
Superior Supersafe® No. 30 contains an amino acid-halide activator which starts to clean metals at room temperature, reaching peak fluxing activity at 260°C/500°F, where it promotes excellent solderability. The broad range of activity makes Superior Supersafe® No. 30 an ideal choice for high production rates or difficult metal surface conditions where an active, but safe, flux is required.
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Superior No. 71 — HIGH ACTIVITY STAINLESS STEEL FLUX
Formulated for soldering Stainless Steel and High-Chrome Alloys.
Excellent across a broad range of base metals, solders, and temperatures.
Exhibits excellent capillary action.
DESCRIPTION
Superior No. 71 is a water-based, inorganic-acid flux formulated for soldering stainless steel and other industrial metals. The flux contains Zinc Chloride, Ammonium Chloride, a bi-fluoride, and Hydrochloric Acid. This combination of activators makes this flux active at room temperature where it begins to clean metals and remove oxides. The flux exerts a strong scavenging action to remove oxide coatings and other impurities from the metal surface to produce strong joints. Pre-cleaning is not necessary under most conditions.
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SUPERIOR No. 334 — NO-CLEAN SOLDERING FLUX
Formulated for wire tinning, component tinning, and wave soldering/spray flux applications
Excellent for tinning of insulated and braided wire and solder coating of printed circuit boards
Contains no rosins or resins
Meets all of the requirements of Bellcore TR-NWT-000078, Issue 3, December, 1991
IPC, ANSI J-STD-004, Type ORL0
DESCRIPTION
Superior No. 334 No-Clean flux is specially formulated for automated and manual wire tinning applications, and for spray flux application in wave soldering. Superior No. 334 is an alcohol-based No-Clean flux that has excellent activity levels and affords a wide process window for a No-Clean flux. The post-solder residue exceeds the minimum Bellcore and IPC requirements for cleanliness and provides long-term reliability for critical connections and components.
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Reach us to order your Superior No. 334 flux today.